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I-Tankii 1.0mm yocingo oluTinki lweCopper T2 oluBomvu lweCopper Anti-Oxidation & neConductivity egqwesileyo eboniswayo
  • I-Tankii 1.0mm iTinned Copper Wire T2 Red Copper Anti-Oxidation & Conductivity egqwesileyo

I-Tankii 1.0mm iTinned Copper Wire T2 Red Copper Anti-Oxidation & Conductivity egqwesileyo

Inkcazelo emfutshane:


  • Igama lemveliso:Ngocingo oluTinki lweKopolo
  • Ububanzi:1.0mm
  • Unyamezelo lweDayimitha:±0.02mm
  • Ukutyeba kweNgqungquthela yeTin:3-5μ
  • Ukuqhutywa koMbane (20℃):≥98% IACS
  • Tensile strength:200-250 MPa
  • Ukwandiswa ngexesha lekhefu:≥30% (L0=200mm)
  • Uluhlu lobushushu obusebenzayo:-40℃~150℃

    • Iinkcukacha zeMveliso

    FAQ

    Iithegi zeMveliso

    Ingcaciso yeMveliso

    1.0mm ngocingo oluTinki lweKopha (Umongo weKopha oBomvu osulungekileyo, 3-5μ Ukugqunywa kweTin)

    Product Overview

    Njengomqhubi wombane othembekileyo ovela kwi-Tankii Alloy Material, i1.0mm ucingo lobhedu olunkonkxiweyoidibanisa iingenelo ezimbini eziphambili: i-ultra-high conductivity yobhedu olusulungekileyo obomvu (ibakala le-T2) kunye nokukhuselwa kokuchasana nokuchaneka kokuchaneka kwe-tin 3-5μ. Yenziwe ngenkqubo kaHuona eqhubela phambili eqhubekayo eshushu-efakwe kwi-real-time esweni ubukhulu kunye nolawulo lobushushu-ucingo luqinisekisa ukuba umaleko wetin unamathela ngokulinganayo kumbindi wobhedu oluqilima oluyi-1.0mm, akukho mingxunya okanye amabala abhityileyo. Isombulula iintlungu ezimbini eziphambili zeentlungu zocingo olungenanto lobhedu: ukuhla kwe-conductivity eyenziwe nge-oxidation kunye nokuthengiswa kakubi, okwenza kube yintsika yokudibanisa kombane efuna ukuzinza kwexesha elide, ukudibanisa okulula, kunye nokuchasana neendawo ezimanzi / zamashishini.

    Iziqinisekiso zoMgangatho kunye nezeMathiriyeli

    • IBanga loMqhubi: T2 ubhedu obomvu ococekileyo (ihambelana ne-GB / T 3956-2008; ilingana ne-ASTM B33, i-IEC 60288 i-Class 1)
    • Tin Coating Standard: GB/T 4910-2009, IEC 60317-2 (i-lead-free: Pb ≤0.005%, Sn ≥99.9%)
    • Iziqinisekiso zoMgangatho: RoHS 2.0 iyahambelana, ISO 9001 inkqubo yolawulo lomgangatho, imvume yovavanyo lwe-SGS yokusingqongileyo
    • Umenzi: I-Tankii Alloy Material (iminyaka eyi-15+ yamava okuqhuba umqhubi wobhedu)

    Izinto eziluncedo kwiNtsebenzo engundoqo

    1. I-Conductor ye-Copper ecocekileyo: i-Conductivity engafaniyo

    • Ukuqhuba koMbane: ≥98% IACS (20℃), egqithise kakhulu ubhedu oluxutyiweyo (umz., iialloyi zeCuNi: ~20% IACS) kunye ne-aluminium (61% IACS). Iqinisekisa ukuhla kwamandla ombane omncinci kwiisekethe zombane ophantsi (umzekelo, i-12V iingcingo zemoto, iintambo ze-USB eziyi-5V) kunye nokuhanjiswa komqondiso okhawulezayo kwizinzwa.
    • Ukudutyulwa koomatshini: Elongation ≥30% (25℃) kunye namandla okuqina ≥200 MPa. Inokumelana nokugoba okuphindaphindiweyo (uvavanyo lwe-180 ° bend ≥10 amaxesha ngaphandle kokuqhawula) kwi-wiring kwiindawo ezixineneyo (umzekelo, izixhobo zangaphakathi zangaphakathi, i-PCB edge uxhumano).

    2. 3-5μ Ukuchaneka kweTin Coating: uKhuseleko oluJolisiweyo

    • I-Anti-Oxidation Barrier: I-Dense tin layer ikhusela umoya / umswakama ekudibaniseni nobhedu, ukuthintela ukubunjwa kwe-copper oxide conductive (CuO / Cu₂O). Nangona kwi-80% yomswakama kwiinyanga ezili-12, ucingo lugcina i-≥97% conductivity yokuqala (vs. Ubhedu olungenanto: lwehla ukuya kwi-85% kwiinyanga ezi-3).
    • I-Solderability eyongeziweyo: Indawo yokunyibilika kweTin ephantsi (232℃) yenza ukuba “umanzise ngoko nangoko” ngexesha le-solder—akukho kucoca kwangaphambili okanye kuvuleleke kusebenze. Yehlisa ixesha lokudityaniswa kwe-PCB nge-40% vs.
    • Uyilo lokutyeba olulungeleleneyo: : 3-5μ ubukhulu ukuphepha ukugqithisela ezimbini: iingubo ezibhityileyo (<3μ) azikwazi ukugquma iziphene zobhedu, ngelixa iingubo ezityebileyo (> 5μ) zenza ucingo lube brittle (luthambekele ekuqhekekeni ngexesha lokugoba).

    IiNgcaciso zobuGcisa

    Ipharamitha
    Ixabiso elineenkcukacha
    Idayamitha yeNominal (Iphelele)
    1.0mm (i-conductor: ~ 0.992-0.994mm; inkuku yokwaleka: 3-5μ)
    Ukunyamezela kwe-Diameter
    ±0.02mm
    Ukutyeba kweTin Coating
    3μ (ubuncinci) - 5μ (ubuninzi); ukufana kobuninzi: ≥95% (akukho ndawo <2.5μ)
    Ukuqhutywa koMbane (20℃)
    ≥98% IACS
    Tensile strength
    200-250 MPa
    Ukwandiswa ngexesha lekhefu
    ≥30% (L0=200mm)
    Ukubambelela kwiTin
    Akukho ukuxobula / ukugqabhuka emva kokugoba kwe-180 ° (i-radius = 5mm) + uvavanyo lwetape (i-3M 610 tape, akukho ntsalela ye-tin)
    Ukunyangwa kokuMhlwa
    Upase i-ASTM B117 yovavanyo lwesitshizi setyuwa (48h, 5% NaCl, 35℃) - akukho mhlwa obomvu, ukugqabhuka kwetoti
    Uluhlu lobushushu obusebenzayo
    -40 ℃ (ubushushu obuphantsi, akukho kuqhekeka) ukuya kwi-105 ℃ (ukusetyenziswa okuqhubekayo, akukho tinyibilikiyo)

    Ubonelelo ngeMveliso kunye nokuLungisa

    Into
    Inkcazo
    Ifomu yokuBonelela
    Umqhubi oqinileyo (umgangatho); umqhubi we-stranded (isiko: 7/0.43mm, 19/0.26mm)
    Uqwalaselo lweSpool
    500m/1000m ngespool nganye (izinto zespool: iplastiki yeABS, ubukhulu: 200mm, umngxuma ongundoqo: 50mm)
    Umphezulu Gqiba
    Itoti eqaqambileyo (ehlala ikho); i-matte tin (isiko, kwizicelo ezichasene nokukhazimla)
    Unyango olongezelelweyo
    Ukugquma ngokuzikhethela (PVC/XLPE/Silicone, ubukhulu: 0.1-0.3mm, umbala: omnyama/obomvu/bhlowu)
    Ukupakishwa
    Ibhegi yefoyile ye-aluminiyam etywiniweyo etywiniweyo (ubungqina bokufuma) + ikhathoni yangaphandle (ene-desiccant, i-anti-impact)

    Iimeko zosetyenziso oluqhelekileyo

    • IziXhobo zaseKhaya: Iingcingo zangaphakathi koomatshini bokuhlamba (ukumelana nokufuma), iifriji (ukuguquguquka okuphantsi kobushushu), kunye nee-oveni ze-microwave (ukumelana nobushushu ukuya kuthi ga kwi-105℃).
    • I-Electronics yeemoto: Iitheminali zokuqhagamshela iibhetri zemoto (i-anti-corrosion), i-sensor wiring (uphawu oluzinzileyo), kunye neenkqubo zolwazi lwemoto ngaphakathi (i-voltage ephantsi).
    • PCB & Consumer Electronics: Nge-solder ye-hole ye-Arduino/i-Raspberry Pi iibhodi, ii-cable conductors ze-USB-C, kunye ne-LED strip wiring (indibano elula).
    • Ulawulo lwemizi-mveliso: Iingcingo zeepaneli ze-PLC (ukumelana nokufuma kwamashishini) kunye nokunikezelwa kwamandla aphantsi (ukulahlekelwa kwamandla amancinci).
    • Izixhobo zonyango: Iingcingo zangaphakathi zezixhobo zokuxilonga eziphathekayo (i-lead-free, ihambelana nemigangatho ye-biocompatibility) kunye neepompo ezincinci zonyango (ukugoba okuguquguqukayo).

    Ukuqinisekiswa koMgangatho ovela kwi-Tankii Alloy Material

    Yonke ibhetshi ye1.0mm ucingo lobhedu olunkonkxiweyoihlolwa kathathu:
    1. Uvavanyo lokutyeba kweTin: Umhlalutyi we-X-ray fluorescence (XRF) (uchaneka: ± 0.1μ) - amanqaku ama-5 esampula kwi-spool nganye.
    1. Uvavanyo lokuqhuba: Umhloli weprobe wamanqaku amane (ukuchaneka: ± 0.5% IACS) - iisampuli ze-3 kwibhetshi nganye.
    1. Uvavanyo loomatshini: Umatshini wokuvavanya jikelele (i-tensile / elongation) + i-bend tester (i-adhesion) - iisampuli ze-2 ngebhetshi nganye.
    Iisampulu zasimahla (ubude obuyi-1m, iziqwenga ezi-2-3 ngokwenkcazo nganye) kunye neeNgxelo ezineenkcukacha zoVavanyo lweMpahla (MTR) ziyafumaneka xa ziceliwe. Iqela lethu lobugcisa libonelela ngenkxaso ye-1-on-1 kwiimfuno zesiko (umzekelo, ukukhethwa kwezinto zokufakela ubushushu obuphezulu, idizayini ye-conductor edibeneyo yocingo oluguquguqukayo).
  • Ngaphambili:
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