Wamkelekile kwiiwebhusayithi zethu!
I-Silver Coated Copper Tape High Conductivity yokuKhusela uMbane kunye noQhagamshelwano oluchanekileyo
Inkcazo yeMveliso
ISilivere-iPlated Copper Strip
Isishwankathelo seMveliso
Umtya wobhedu ocwecwe wesilivere udibanisa ukuhanjiswa okuphezulu kobhedu olusulungekileyo kunye nokusebenza kombane okongeziweyo kunye nokunganyangeki kokutya kwesilivere. Isiseko sobhedu sibonelela ngesiseko esizinzileyo esisezantsi - ukuxhathisa, ngelixa i-uniform yesilivere yeplating layer iphucula umgangatho we-conductivity kunye nokumelana ne-oxidation. Isetyenziswa kakhulu kwi-electromagnetic shielding, high-frequency transformers, lithium-ion battery tabs, kunye nezinto ezichanekileyo zombane.
Ukutyunjwa okusemgangathweni
- Imigangatho yezinto eziphathekayo:
- Isiseko sobhedu: Ihambelana ne-ASTM B152 (iphepha lobhedu kunye nemigangatho yemicu).
- I-Silver Plating: Ilandela i-ASTM B700 (i-electrodeposited silver coatings).
- Izinto zombane: Idibana ne-IEC 61238 kunye ne-MIL-STD-883 imigangatho.
Iimpawu eziphambili
- I-Superior surface conductivity: I-Silver plating iqinisekisa ilahleko ephantsi yomqondiso kwi-high-frequency applications
- Ukhuseleko olugqwesileyo lwe-electromagnetic: luthintela uphazamiseko kwiinkqubo ezibuthathaka zombane
- Ukuxhathisa okuqinileyo ku-corrosion: Ixhathisa i-oxidation kunye nokufuma kwindawo enzima
- Ukuchaneka okuphezulu komgangatho: Ubukhulu obufanayo kunye nokuthe tyaba kokusebenza okufanayo
- Ukumila kakuhle: Inokusikwa, igotywe, kwaye igximfizwe kwiimilo eziqhelekileyo
Iinkcukacha zobuGcisa
| Uphawu | Ixabiso |
| Isiseko seCopper Purity | ≥99.95%. |
| Ukutyeba kweSilver Plating | 0.5μm–8μm (inokwenziwa ngokwezifiso). |
| Ukutyeba komcu | 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.8mm (inokwenziwa ngokwezifiso) |
| Ububanzi bomcu | 3mm, 5mm, 10mm, 15mm, 20mm, 30mm (inokwenziwa ngokwezifiso ukuya kuthi ga kwi-100mm) |
| Amandla e-Tensile | 260-360 MPa |
| Ukwandisa | ≥25%. |
| Ukuqhuba koMbane | ≥99% IACS |
| Ubushushu bokusebenza | - 70°C ukuya kwi-160°C |
Ukubunjwa kweMichiza (Eqhelekileyo,%)
| Icandelo | Umxholo (%) |
| Ubhedu (Isiseko). | ≥99.95 |
| Isilivere (Plating). | ≥99.9 |
| Landela ukungcola | ≤0.05 (iyonke). |
Iimpawu zeMveliso
| Into | Inkcazo |
| Ubude ngomqulu ngamnye | 50m, 100m, 300m, 500m (inokwenziwa ngokwezifiso) |
| Ukupakishwa | I-vacuum - itywinwe kwiingxowa ezichasene ne-static; zipakishwe kwiibhokisi zekhadibhodi ezinobumanzi - iileya zobungqina |
| Umphezulu wokuGqibela | Isibuko-isilivere ekhazimlisiweyo yokucwenga ngeRa ≤0.8μm |
| Ukunyamezelwa kweFlatness | ≤0.01mm/m (iqinisekisa uqhagamshelwano olufanayo). |
| Inkxaso ye-OEM | Ububanzi besiko, ubukhulu, ubukhulu be-plating, kunye nokusika kwe-laser kuyafumaneka |
Sikwabonelela nangeminye imicu yekopha ecandiweyo efana negolide - umcu wobhedu ocandiweyo kunye ne-nickel - copper strip. Iisampulu zasimahla kunye nedatha yedatha yezobugcisa iyafumaneka xa uceliwe. Iinkcukacha ngokwesiqhelo zinokulungiswa ukuhlangabezana neemfuno zokhuseleko, ukuqhuba, okanye ibhetri.
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